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SERCOS interface Packaging Profile Available

July 19, 2004 -- The Packaging Machinery Working Group of the North American OMAC (Open Modular Architecture Controls) Users Group published a recommendation in November 2001 to use SERCOS interface (IEC 61491) as an open drive interface for packaging machines. In this context, the group challenged the SERCOS organizations to further improve the multi-vendor interoperability of servo controls and drives on the basis of a packaging profile.

The SERCOS organizations created a packaging profile that defines a subset of the 500 SERCOS interface parameters that are applicable to packaging machines. A new certification test to ensure conformance to the packaging profile is now available. Thus, conforming devices will be plug-and-play interoperable for packaging applications.

Read the following items for a progress report on the SERCOS interface packaging profile:

Press Release –- SERCOS Vendor Organizations Release Packaging Profile

White Paper –- Packaging profile to improve the interoperability of controls and drives

Technical Specification –- Pack Profile Specification